? semiconductor components industries, llc, 2003 december, 2003 ? rev. 3 1 publication order number: bcp53t1/d bcp53t1 series preferred devices pnp silicon epitaxial transistors this pnp silicon epitaxial transistor is designed for use in audio amplifier applications. the device is housed in the sot-223 package which is designed for medium power surface mount applications. ? high current: 1.5 amps ? npn complement is bcp56 ? the sot-223 package can be soldered using wave or reflow. the formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die ? available in 12 mm tape and reel use bcp53t1 to order the 7 inch/1000 unit reel. use bcp53t3 to order the 13 inch/4000 unit reel. ? device marking: bcp53t1 = ah bcp53?10t1 = ah?10 bcp53?16t1 = ah?16 ? pb?free package may be available. the g?suffix denotes a pb?free lead finish maximum ratings (t c = 25 c unless otherwise noted) rating symbol value unit collector-emitter voltage v ceo ?80 vdc collector-base voltage v cbo ?100 vdc emitter-base voltage v ebo ?5.0 vdc collector current i c 1.5 adc total power dissipation @ t a = 25 c (note 1.) derate above 25 c p d 1.5 12 watts mw/ c operating and storage temperature range t j , t stg ?65 to +150 c thermal characteristics characteristic symbol max unit thermal resistance, junction to ambient (surface mounted) r q ja 83.3 c/w lead temperature for soldering, 0.0625 from case time in solder bath t l 260 10 c sec 1. device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in. device package shipping 2 ordering information bcp53t1 sot?223 sot?223 case 318e style 1 1000/tape & reel medium power high current surface mount pnp transistors 1 2 3 4 preferred devices are recommended choices for future use and best overall value. collector 2,4 base 1 emitter 3 bcp53?10t1 sot?223 1000/tape & reel ahxxx ahxxx = device code xxx = ?10 or ?16 marking diagram bcp53?16t1 sot?223 1000/tape & reel bcp53t1g sot?223 (pb?free) 1000/tape & reel 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. http://onsemi.com
bcp53t1 series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristics symbol min typ max unit off characteristics collector-base breakdown voltage (i c = ?100 m adc, i e = 0) v (br)cbo ?100 ? ? vdc collector-emitter breakdown voltage (i c = ?1.0 madc, i b = 0) v (br)ceo ?80 ? ? vdc collector-emitter breakdown voltage (i c = ?100 m adc, r be = 1.0 kohm) v (br)cer ?100 ? ? vdc emitter-base breakdown voltage (i e = ?10 m adc, i c = 0) v (br)ebo ?5.0 ? ? vdc collector-base cutoff current (v cb = ? 30 vdc, i e = 0) i cbo ? ? ?100 nadc emitter-base cutoff current (v eb = ? 5.0 vdc, i c = 0) i ebo ? ? ?10 m adc on characteristics dc current gain (i c = ? 5.0 madc, v ce = ? 2.0 vdc) all part types (i c = ?150 madc, v ce = ? 2.0 vdc) bcp53t1 bcp53?10t1 bcp53?16t1 (i c = ? 500 madc, v ce = ? 2.0 vdc) all part types h fe 25 40 63 100 25 ? ? ? ? ? ? 250 160 250 ? ? collector-emitter saturation voltage (i c = ? 500 madc, i b = ? 50 madc) v ce(sat) ? ? ?0.5 vdc base-emitter on voltage (i c = ? 500 madc, v ce = ? 2.0 vdc) v be(on) ? ? ?1.0 vdc dynamic characteristics current-gain ? bandwidth product (i c = ?10 madc, v ce = ? 5.0 vdc, f = 35 mhz) f t ? 50 ? mhz typical electrical characteristics 500 200 100 50 20 1 3 5 10 30 50 100 300 500 1000 i c , collector current (ma) h , dc current gain fe figure 1. dc current gain i c , collector current (ma) f , current gain bandwidth product (mhz) t figure 2. current gain bandwidth product 1000 1 10 100 500 300 100 20 50 i c , collector current (ma) v, voltage (volts) figure 3. saturation and aono voltages 1000 1 1 0.8 0.6 0.4 0 0.2 100 10 120 110 100 90 80 70 60 50 40 30 20 10 0 20 18 16 14 12 10 8 6 4 2 0 v, voltage (volts) figure 4. capacitances c, capacitance (pf) v ce = 2 v v ce = 2 v v (be)sat @ i c /i b = 10 v (be)on @ v ce = 2 v v (ce)sat @ i c /i b = 10 c ib c ob
bcp53t1 series http://onsemi.com 3 package dimensions sot?223 case 318e?04 issue k style 1: pin 1. base 2. collector 3. emitter 4. collector h s f a b d g l 4 123 0.08 (0003) c m k j dim a min max min max millimeters 0.249 0.263 6.30 6.70 inches b 0.130 0.145 3.30 3.70 c 0.060 0.068 1.50 1.75 d 0.024 0.035 0.60 0.89 f 0.115 0.126 2.90 3.20 g 0.087 0.094 2.20 2.40 h 0.0008 0.0040 0.020 0.100 j 0.009 0.014 0.24 0.35 k 0.060 0.078 1.50 2.00 l 0.033 0.041 0.85 1.05 m 0 10 0 10 s 0.264 0.287 6.70 7.30 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 1.5 0.059 figure 5. sot?223 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
bcp53t1 series http://onsemi.com 4 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 bcp53t1/d sensefet is a trademark of semiconductor components industries, llc. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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